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IEC TR 61760-3-1:2022 ED1

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method IEC TR 61760-3-1:2022 ED1

Publication date:   Jun 17, 2022

General information

60.60 Standard published   Jun 17, 2022

IEC

TC 91

Technical Report

31.190   Electronic component assemblies

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Scope

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.

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PUBLISHED
IEC TR 61760-3-1:2022 ED1
60.60 Standard published
Jun 17, 2022