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IEC TR 62878-2-7:2019 ED1

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards IEC TR 62878-2-7:2019 ED1

Publication date:   Mar 20, 2019

General information

60.60 Standard published   Mar 20, 2019

IEC

TC 91

Technical Report

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Life cycle

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PUBLISHED
IEC TR 62878-2-7:2019 ED1
60.60 Standard published
Mar 20, 2019