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IEC TS 62878-2-3:2015 ED1

Device embedded substrate - Part 2-3: Guidelines - Design guide IEC TS 62878-2-3:2015 ED1

Publication date:   Mar 27, 2015

General information

60.60 Standard published   Mar 27, 2015

IEC

TC 91

Technical Specification

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

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PUBLISHED
IEC TS 62878-2-3:2015 ED1
60.60 Standard published
Mar 27, 2015