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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
50.60 Close of voting. Proof returned by secretariat
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
60.60 Standard published
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies
60.60 Standard published
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
60.60 Standard published
Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
60.60 Standard published
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
50.60 Close of voting. Proof returned by secretariat
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
40.60 Close of voting
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/y coefficient of thermal expansion test (CTE) for thick base materials by TMA
40.60 Close of voting
