EN IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity EN IEC 62878-2-602:2021
Publication date:
Dec 16, 2021
General information
60.60
Standard published
Aug 13, 2021
CENELEC
CLC/SR 91
Electronics assembly technology
European Norm
31.180
Printed circuits and boards
| 31.190
Electronic component assemblies
Scope
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Life cycle
NOW
PUBLISHED
EN IEC 62878-2-602:2021
60.60
Standard published
Aug 13, 2021
