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EN IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity EN IEC 62878-2-602:2021

Publication date:   Dec 16, 2021

General information

60.60   Standard published   Aug 13, 2021

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

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PUBLISHED
EN IEC 62878-2-602:2021
60.60 Standard published
Aug 13, 2021




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