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FprEN IEC 61189-2-809:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/y coefficient of thermal expansion test (CTE) for thick base materials by TMA FprEN IEC 61189-2-809:2024

Publication date:   Aug 12, 2022

General information

50.60 Close of voting. Proof returned by secretariat   Nov 1, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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FprEN IEC 61189-2-809:2024
50.60 Close of voting. Proof returned by secretariat
Nov 1, 2024