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EN IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates EN IEC 62878-1:2019

Publication date:   Apr 21, 2020

General information

60.60 Standard published   Dec 6, 2019

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Life cycle

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PUBLISHED
EN IEC 62878-1:2019
60.60 Standard published
Dec 6, 2019