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prEN IEC 61188-6-3:2023

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) prEN IEC 61188-6-3:2023

Publication date:   Aug 25, 2023

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40.60 Close of voting   Nov 17, 2023

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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prEN IEC 61188-6-3:2023
40.60 Close of voting
Nov 17, 2023