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Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
60.60 Standard published
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
60.60 Standard published
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
60.60 Standard published
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
60.60 Standard published
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
60.60 Standard published
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
10.99 New project approved
Environmental testing - Part 2-88: Tests - Test xd: Resistance of components and assemblies to liquid cleaning media
10.99 New project approved
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
40.60 Close of voting
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ed2
10.99 New project approved
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
40.60 Close of voting
Endurance test methods for die attach materials - Part 1: General specification
10.99 New project approved
Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices
10.99 New project approved
Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
10.99 New project approved
Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
40.60 Close of voting