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Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
60.60 Standard published
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
60.60 Standard published
Device embedded substrate - Part 1-1: Generic specification - Test methods
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
60.60 Standard published
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ed2
10.99 New project approved
Endurance test methods for die attach materials - Part 1: General specification
10.99 New project approved
Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices
10.99 New project approved
Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
10.99 New project approved
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
40.20 DIS ballot initiated: 12 weeks
Environmental testing - Part 2-88: Tests - Test xd: Resistance of components and assemblies to liquid cleaning media
40.20 DIS ballot initiated: 12 weeks
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
40.60 Close of voting
Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
40.60 Close of voting
Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
60.60 Standard published
Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
60.60 Standard published
