prEN IEC 63215-4

Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices prEN IEC 63215-4

Current stage: 10.99 New project approved Jul 19, 2021

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.190 Electronic component assemblies

IN_DEVELOPMENT
prEN IEC 63215-4
10.99 New project approved
Jul 19, 2021