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FprEN IEC 62878-2-603:2024

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity FprEN IEC 62878-2-603:2024

Publication date:   Oct 20, 2023

General information

50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks   Dec 20, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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FprEN IEC 62878-2-603:2024
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Dec 20, 2024