prEN IEC 62878-2-603:2023

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity prEN IEC 62878-2-603:2023

Publication date:   Oct 20, 2023

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40.60 Close of voting   Jan 12, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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prEN IEC 62878-2-603:2023
40.60 Close of voting
Jan 12, 2024