Standards search

Use the form below to find particular standards or projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”. You can also search using the Advance Search facility.

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures

40.99 Full report circulated: DIS approved for registration as FDIS

TC 47/SC 47F