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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
60.60 Standard published
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
60.60 Standard published
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
60.60 Standard published
Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
60.60 Standard published
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
60.60 Standard published
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
60.60 Standard published
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
60.60 Standard published
Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
60.60 Standard published
Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
60.60 Standard published
Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
50.00 Final text received or FDIS registered for formal approval
Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
60.60 Standard published
Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
40.99 Full report circulated: DIS approved for registration as FDIS
Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
60.60 Standard published
Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
60.60 Standard published
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
60.60 Standard published
