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IEC TR 62866:2014 ED1

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing IEC TR 62866:2014 ED1

Publication date:   May 7, 2014

General information

60.60 Standard published   May 7, 2014

IEC

TC 91

Technical Report

31.180   Printed circuits and boards

Buying

Published

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Scope

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

Life cycle

NOW

PUBLISHED
IEC TR 62866:2014 ED1
60.60 Standard published
May 7, 2014