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IEC TS 61189-3-301:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB IEC TS 61189-3-301:2016 ED1

Publication date:   Jul 28, 2016

General information

60.60 Standard published   Jul 28, 2016

IEC

TC 91

Technical Specification

31.180   Printed circuits and boards

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Scope

IEC TS 61189-3-301:2016(E) outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.

Life cycle

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PUBLISHED
IEC TS 61189-3-301:2016 ED1
60.60 Standard published
Jul 28, 2016