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Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
60.60 Standard published
Device embedded substrate - Part 1-1: Generic specification - Test methods
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
40.60 Close of voting
Amendment 1 - Printed electronics - Part 201: Materials - Substrates
60.60 Standard published
Printed electronics - Part 201: Materials - Substrates
60.60 Standard published
Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
60.60 Standard published
Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
60.60 Standard published
IEC 62899-202-11 ED1 Printed electronics - Part 202-11: Materials - Conductive ink - Measurement method of electrical resistance uniformity for large area printed conductive layers
40.00 DIS registered
Printed electronics - Part 202: Materials - Conductive ink
60.60 Standard published
Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
60.60 Standard published
Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
60.60 Standard published
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
60.60 Standard published
Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
60.60 Standard published
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
60.60 Standard published
