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IEC 62878-2-602:2021 ED1

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity IEC 62878-2-602:2021 ED1

Publication date:   Jun 22, 2021

General information

60.60 Standard published   Jun 22, 2021

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

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PUBLISHED
IEC 62878-2-602:2021 ED1
60.60 Standard published
Jun 22, 2021