Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate IEC 62899-202-5:2018 ED1
31.180
Printed circuits and boards
| 87.080
Inks. Printing inks
Buying
Published
Scope
IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
Life cycle
NOW
PUBLISHED IEC 62899-202-5:2018 ED1 60.60
Standard published Sep 28, 2018