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IEC 62878-2-603 ED1

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity IEC 62878-2-603 ED1

General information

40.60 Close of voting   Jan 12, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
IEC 62878-2-603 ED1
40.60 Close of voting
Jan 12, 2024