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IEC 62878-2-603 ED1

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity IEC 62878-2-603 ED1

General information

50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks   Dec 20, 2024

PRVD    Jan 31, 2025

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Scope

IEC 62878-2-603 ED1 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

Life cycle

NOW

IN_DEVELOPMENT
IEC 62878-2-603 ED1
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Dec 20, 2024