Provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.
The contents of the corrigendum of August 2003 have been included in this copy.
WITHDRAWN
IEC PAS 62177:2000 ED1
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
WITHDRAWN
IEC 60749-4:2002 ED1
99.60
Withdrawal effective
Mar 3, 2017
WITHDRAWN
IEC 60749-4:2002/COR1:2003 ED1
PUBLISHED
IEC 60749-4:2017 ED2