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IEC 60749-4:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) IEC 60749-4:2002 ED1

Publication date:   Apr 12, 2002

General information

99.60 Withdrawal effective   Mar 3, 2017

WPUB   

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Buying

Revised

Language in which you want to receive the document.

Scope

Provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62177:2000 ED1

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

WITHDRAWN
IEC 60749-4:2002 ED1
99.60 Withdrawal effective
Mar 3, 2017

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-4:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-4:2017 ED2