Revised
Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
WITHDRAWN
IEC PAS 62182:2000 ED1
WITHDRAWN
IEC 60749-30:2005 ED1
99.60
Withdrawal effective
Aug 17, 2020
WITHDRAWN
IEC 60749-30:2005/AMD1:2011 ED1
PUBLISHED
IEC 60749-30:2020 ED2