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IEC PAS 62182:2000 ED1

Preconditioning of nonhermetic surface mount devices prior to reliability testing IEC PAS 62182:2000 ED1

Publication date:   Sep 14, 2000

General information

99.60 Withdrawal effective   Jan 20, 2005

IEC

TC 47

Publicly Available Specification

31.080.01   Semiconductor devices in general

Buying

Replaced

Language in which you want to receive the document.

Scope

Establishes an industry standard preconditioning flow for nonhermetic solid state surface mount devices that is representative of a typical industry multiple solder reflow operation.

Life cycle

NOW

WITHDRAWN
IEC PAS 62182:2000 ED1
99.60 Withdrawal effective
Jan 20, 2005

REVISED BY

WITHDRAWN
IEC 60749-30:2005 ED1