60.60 Standard published Jan 7, 2010
IEC
International Standard
31.080.01 Semiconductor devices in general
Published
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.
The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.
WITHDRAWN
IEC PAS 60191-6-18:2008 ED1
PUBLISHED
IEC 60191-6-18:2010 ED1
60.60
Standard published
Jan 7, 2010
PUBLISHED
IEC 60191-6-18:2010/COR1:2010 ED1
PUBLISHED
IEC 60191-6-18:2010/COR2:2010 ED1