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IEC PAS 60191-6-18:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) IEC PAS 60191-6-18:2008 ED1

Publication date:   Jan 22, 2008

General information

99.60 Withdrawal effective   Jan 7, 2010

IEC

TC 47/SC 47D

Publicly Available Specification

31.080.01   Semiconductor devices in general

Buying

Replaced

Language in which you want to receive the document.

Scope

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

Life cycle

NOW

WITHDRAWN
IEC PAS 60191-6-18:2008 ED1
99.60 Withdrawal effective
Jan 7, 2010

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60191-6-18:2010/COR1:2010 ED1

PUBLISHED
IEC 60191-6-18:2010/COR2:2010 ED1

REVISED BY

PUBLISHED
IEC 60191-6-18:2010 ED1