IEC 60191-6-18:2010/COR2:2010 ED1

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) IEC 60191-6-18:2010/COR2:2010 ED1

Current stage: 60.60 Standard published Jul 28, 2010

Originator: IEC

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

PUBLISHED
IEC 60191-6-18:2010/COR2:2010 ED1
60.60 Standard published
Jul 28, 2010