IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.
WITHDRAWN
EN 60749-15:2003
WITHDRAWN
EN 60749-15:2010
99.60
Withdrawal effective
Aug 18, 2023
WITHDRAWN
EN 60749-15:2010/AC:2011
PUBLISHED
EN IEC 60749-15:2020