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EN 60749-15:2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices EN 60749-15:2003

Publication date:   Dec 22, 2003

General information

99.60 Withdrawal effective   Dec 1, 2013

CENELEC

CLC/SR 47 Semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

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Scope

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 60749:1999/A2:2001

WITHDRAWN
EN 60749:1999/A1:2000

WITHDRAWN
EN 60749:1999

NOW

WITHDRAWN
EN 60749-15:2003
99.60 Withdrawal effective
Dec 1, 2013

REVISED BY

WITHDRAWN
EN 60749-15:2010