EN 60068-2-58:2004

Name: EN 60068-2-58:2004
Brand: CENELEC
SKU: EN 60068-2-58:2004
Price: 48.78 EUR
Availability: InStock
Rating: 4 (91 reviews)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publication date: Dec 27, 2006

General information

Current stage: 99.60 Withdrawal effective May 1, 2018

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 19.040 Environmental testing | 31.190 Electronic component assemblies

Buying

Status: Withdrawn

PDF - €48.78

Languages: English

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Scope

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 60068-2-58:1999

NOW

WITHDRAWN
EN 60068-2-58:2004
99.60 Withdrawal effective
May 1, 2018

CORRIGENDA / AMENDMENTS

WITHDRAWN
EN 60068-2-58:2004/corrigendum Dec. 2004

REVISED BY

PUBLISHED
EN 60068-2-58:2015