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EN 60068-2-58:1999

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58:1999

Publication date:   Dec 27, 2006

General information

99.60 Withdrawal effective   Sep 1, 2007

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

19.040   Environmental testing | 31.190   Electronic component assemblies

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Scope

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Life cycle

PREVIOUSLY

WITHDRAWN
HD 323.2.58 S1:1991

NOW

WITHDRAWN
EN 60068-2-58:1999
99.60 Withdrawal effective
Sep 1, 2007

REVISED BY

WITHDRAWN
EN 60068-2-58:2004