EN 60068-2-58:2004/corrigendum Dec. 2004

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58:2004/corrigendum Dec. 2004

General information

99.60   Withdrawal effective   May 1, 2018

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

Life cycle

PREVIOUSLY

WITHDRAWN
EN 60068-2-58:2004

NOW

WITHDRAWN
EN 60068-2-58:2004/corrigendum Dec. 2004
99.60 Withdrawal effective
May 1, 2018

REVISED BY

PUBLISHED
EN 60068-2-58:2015




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