Projects

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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

60.60 Standard published

CLC/SR 91

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

60.60 Standard published

CLC/SR 91

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

60.60 Standard published

CLC/SR 91

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

60.60 Standard published

CLC/SR 91

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

60.60 Standard published

CLC/SR 91

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

60.60 Standard published

CLC/SR 91

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

60.60 Standard published

CLC/SR 91

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

60.60 Standard published

CLC/SR 91

Complete filter units for radio interference suppression - Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ)

60.60 Standard published

CLC/TC 40XA

Complete filter units for radio interference suppression - Part 2-2: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (safety tests only)

60.60 Standard published

CLC/TC 40XA

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

60.60 Standard published

CLC/SR 91

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

60.60 Standard published

CLC/SR 91

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

60.60 Standard published

CLC/SR 91

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

60.60 Standard published

CLC/SR 91

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

60.60 Standard published

CLC/SR 91

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

60.60 Standard published

CLC/SR 91

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

60.60 Standard published

CLC/SR 91

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

60.60 Standard published

CLC/SR 91