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Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
60.60 Standard published