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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
60.60 Standard published
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
60.60 Standard published
Device embedded substrate - Part 2-1: Guidelines - General description of technology
60.60 Standard published
Device embedded substrate - Part 2-3: Guidelines - Design guide
60.60 Standard published
Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
60.60 Standard published
Printed electronics-Part 506-1: Quality assessment- Pull force and water immersion test methods for printed and flexible heating elements
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
