0

IEC 63055:2023 ED2

Format for LSI-Package-Board Interoperable design IEC 63055:2023 ED2

Publication date:   Oct 11, 2023

General information

60.60 Standard published   Oct 11, 2023

IEEE

TC 91

International Standard

31.180   Printed circuits and boards | 31.200   Integrated circuits. Microelectronics | 35.060   Languages used in information technology

Buying

Published

Language in which you want to receive the document.

Scope

IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 63055:2016 ED1

NOW

PUBLISHED
IEC 63055:2023 ED2
60.60 Standard published
Oct 11, 2023