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Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
60.60 Standard published
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
60.60 Standard published
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
60.60 Standard published
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
60.60 Standard published
Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
60.60 Standard published
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
60.60 Standard published
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
60.60 Standard published
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
60.60 Standard published
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
60.60 Standard published
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
60.60 Standard published
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
60.60 Standard published
