IEC 61249-8-8:1997 ED1

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings IEC 61249-8-8:1997 ED1

Publication date:   Jun 24, 1997

General information

60.60 Standard published   Jun 24, 1997

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Published

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Scope

Provides requirements for the qualification of temporary solder resist coatings.

Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Life cycle

NOW

PUBLISHED
IEC 61249-8-8:1997 ED1
60.60 Standard published
Jun 24, 1997