IEC 61249-4-17:2009 ED1

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly IEC 61249-4-17:2009 ED1

Publication date:   May 26, 2009

General information

60.60 Standard published   May 26, 2009

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61249-4-17:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-38 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 120 °C minimum.

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PUBLISHED
IEC 61249-4-17:2009 ED1
60.60 Standard published
May 26, 2009