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Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
40.60 Close of voting
Endurance test methods for die attach materials – Part 1: General specification
20.99 WD approved for registration as CD
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
60.60 Standard published
Endurance test methods for die attach materials – Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices
30.60 Close of voting/ comment period
Endurance test methods for die attach materials – Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
40.60 Close of voting
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
60.60 Standard published
Fixed folding Durability test method for flexible opto-electric circuit boards
20.99 WD approved for registration as CD
High-level test description table for development of production test programs
20.99 WD approved for registration as CD
Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
60.60 Standard published
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
60.60 Standard published
Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
60.60 Standard published
Supporting documentation and guidance - Confirmation of the performance of whisker test method
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
60.60 Standard published
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
60.60 Standard published
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
60.60 Standard published
