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IEC 63251:2023 ED1

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress IEC 63251:2023 ED1

Publication date:   Nov 1, 2023

General information

60.60   Standard published   Nov 1, 2023

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

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PUBLISHED
IEC 63251:2023 ED1
60.60 Standard published
Nov 1, 2023




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