Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.
WITHDRAWN
IEC PAS 62191:2000 ED1
95.99
Withdrawal of Standard
Jan 31, 2002
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2