IEC PAS 62185:2000 ED1

Thermal shock test method

Publication date:   Aug 22, 2000

95.99 Withdrawal of Standard   Jul 1, 2002

General information

95.99 Withdrawal of Standard   Jul 1, 2002

IEC

TC 47

Publicly Available Specification

31.080.01   Semiconductor devices in general

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Scope

This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.

Life cycle

NOW

WITHDRAWN
IEC PAS 62185:2000 ED1
95.99 Withdrawal of Standard
Jul 1, 2002

REVISED BY

PUBLISHED
IEC 60749-11:2002 ED1