IEC PAS 62174:2000 ED1

Name: IEC PAS 62174:2000 ED1
Brand: IEC
SKU: IEC PAS 62174:2000 ED1
Price: 24.2 EUR
Availability: InStock
Rating: 4 (65 reviews)

Resistance to soldering temperature for through-hole mounted devices

Publication date: Aug 22, 2000

95.99 Withdrawal of Standard Mar 31, 2003

General information

Current stage: 95.99 Withdrawal of Standard Mar 31, 2003

Originator: IEC

Owner: TC 47

Type: Publicly Available Specification

ICS: 31.080.01 Semiconductor devices in general

Buying

Status: Replaced

PDF - €24.20

Languages: English

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Scope

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Life cycle

NOW

WITHDRAWN
IEC PAS 62174:2000 ED1
95.99 Withdrawal of Standard
Mar 31, 2003

REVISED BY

WITHDRAWN
IEC 60749-15:2003 ED1