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IEC PAS 62174:2000 ED1

Resistance to soldering temperature for through-hole mounted devices IEC PAS 62174:2000 ED1

Publication date:   Aug 22, 2000

95.99 Withdrawal of Standard   Mar 31, 2003

General information

95.99 Withdrawal of Standard   Mar 31, 2003

IEC

TC 47

Publicly Available Specification

31.080.01   Semiconductor devices in general

Buying

Replaced

Language in which you want to receive the document.

Scope

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Life cycle

NOW

WITHDRAWN
IEC PAS 62174:2000 ED1
95.99 Withdrawal of Standard
Mar 31, 2003

REVISED BY

WITHDRAWN
IEC 60749-15:2003 ED1