Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.
Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.
WITHDRAWN
IEC PAS 62173:2000 ED1
99.60
Withdrawal effective
Mar 15, 2004
WITHDRAWN
IEC 60749-21:2004 ED1