IEC 60749-21:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability IEC 60749-21:2004 ED1

Publication date:   Mar 15, 2004

Scope

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.