Aims at evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. Employs conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors which pass through it.
WITHDRAWN
IEC PAS 62161:2000 ED1
95.99
Withdrawal of Standard
Mar 15, 2003
WITHDRAWN
IEC 60749-5:2003 ED1