Revised
Provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
WITHDRAWN
IEC PAS 62161:2000 ED1
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
WITHDRAWN
IEC 60749-5:2003 ED1
99.60
Withdrawal effective
Apr 10, 2017
WITHDRAWN
IEC 60749-5:2017 ED2