IEC 62878-2-602:2021 ED1
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
Publication date:
Jun 22, 2021
General information
60.60
Standard published
Jun 22, 2021
IEC
TC 91
International Standard
31.180
Printed circuits and boards
| 31.190
Electronic component assemblies
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Scope
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Life cycle
NOW
PUBLISHED
IEC 62878-2-602:2021 ED1
60.60
Standard published
Jun 22, 2021