60.60 Standard published Jul 26, 2011
IEC
International Standard
31.080.99 Other semiconductor devices
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
PUBLISHED
IEC 62047-10:2011 ED1
60.60
Standard published
Jul 26, 2011
PUBLISHED
IEC 62047-10:2011/COR1:2012 ED1